What characterizes the process of abrasion soldering?

The process of abrasion soldering is characterized by mechanical abrasion of the faying surface. This technique involves physically roughening the surfaces to be joined, creating a better mechanical bond by increasing the surface area and allowing for improved penetration of the solder. The abrasion process removes any oxides or contaminants that may interfere with the bonding process, ensuring a cleaner joint which is more conducive to achieving a strong bond when the solder is applied.

This method is particularly beneficial in situations where traditional methods that rely on heat or chemical fluxes may not be suitable, as it does not require the melting of base metals, chemical application, or the incorporation of additional filler materials. Instead, the abrasive action itself facilitates the solder's ability to adhere effectively to the prepared surfaces, making this option the defining characteristic of abrasion soldering.